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Only One Name Means ProT ek'TionTM
U0402FC36C
UNBUMPED FLIP CHIP ARRA Y
APPLICA TIONS Cellular Phones MCM Boards Wireless Communication Circuits IR LEDs SMART & PCMCIA Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ESD Protection > 25 kilovolts Available in Multiple Voltage Types Ranging From 3.3V to 36V 250 Watts Peak Pulse Power per Line (tp = 8/20s) Bidirectional Configuration & Monolithic Structure Protects 1 Line RoHS Compliant MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0402 Weight 0.73 milligrams (Approximate) Solder Reflow Temperature: Tin-Lead - Sn/Pb: 240-245C Lead-Free: 260-270C Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel U0402
PIN CONFIGURA TION
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DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 250 -55C to 150C -55C to 150C UNITS Watts C C
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 7.0 9.8 13.4 19.0 24.0 43.0 64.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) @VWM ID A 75* 10** 10*** 1 1 1 1 TYPICAL CAPACITANCE
V WM VOLTS U0402FC3.3C U0402FC05C U0402FC08C U0402FC12C U0402FC15C U0402FC24C U0402FC36C 3.3 5.0 8.0 12.0 15.0 24.0 36.0
@ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 40.0
@8/20s VC @ IPP 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A
@0V, 1 MHz C pF 150 100 75 50 40 30 25
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
10,000
IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s
1,000 250W, 8/20s Waveform
e-t
100
td = t I /2 PP
10 0.01
1
10 100 td - Pulse Duration - s
1,000
10,000
0
5
10
15 t - Time - s
20
25
30
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U0402FC36C
GRAPHS
FIGURE 3 POWER DERATING CURVE
Peak Pulse Power 8/20s
100 80
% Of Rated Power
60
40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150
FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR U0402FC05C
35
5 Volts per Division
25
15
5
-5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0402FC05C
14 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 05149.R4 3/05 3 www.protekdevices.com 15 20
VC - Clamping Voltage - Volts
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U0402FC36C
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - C
Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat
t 25C to Peak 30-60 seconds
Ramp-up 15 seconds
Solder Time 15-20 seconds
Ramp-down
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE U0402
TOP
SIDE
A
C
B
PACKAGE DIMENSIONS DIM
A B C D E F I
MILLIMETERS
0.46 NOM 0.86 NOM 0.99 0.0254 0.10 NOM 0.35 NOM 0.483 0.0254 0.406 NOM
INCHES
0.018 NOM 0.034 NOM 0.039 0.001 0.004 NOM 0.014 NOM 0.019 0.001 0.016 NOM
E F Metalized Die Contacts
D
END
I
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Maximum chip size: 1.02 (0.040") by 0.51(0.020").
MOUNTING PAD DIM
C B A
D
PAD DIMENSIONS MILLIMETERS
0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13
INCHES
0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005
SOLDER PAD
DIE CONTACTS
A B C D E F G H I
DIE
H
E
NOTE: 1. Top view of tape. Metal contacts are face down in tape package.
F
I
T APE & REEL ORIENT TION A
SOLDER PRINT DIAMETER 0.010" 0.012"
G
Single Die - 0402
TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., U0402FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., U0402FC05C-T710-2).
NOTE: 1. Preferred: Using 0.1mm (0.004") stencil. Outline & Dimensions: Rev 3 - 11/02, 06020
COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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